2026 9th International Conference on Materials Design and Applications (ICMDA 2026)

In Person and Online

Event Type Conference
Submission Deadline 11/25/2025
Start Date 4/17/2026
End Date 4/20/2026
City and Country Sendai, Japan
Website http://www.icmda.org
Organized by Tohoku University

Publication: Defect and Diffusion Forum (DDF); Solid State Phenomena (SSP); Materials Science Forum (MSF); Key Engineering Materials (KEM). Papers will be sent for indexing by Scopus, Inspec, Chemical Abstracts Service, Google Scholar etc.